3D-Stacked HBM Architecture Susceptibility To Thermal Attacks (NC A&T State, New Mexico State)

A new technical paper titled “On the Thermal Vulnerability of 3D-Stacked High-Bandwidth Memory Architectures” was published by researchers at North Carolina A&T State University and New Mexico State University. Abstract “3D-stacked High Bandwidth Memory (HBM) architectures provide high-performance memory interactions to address the well-known performance challenge, namely the memory wall. However, these architectures are susceptible… » read more